SpeCLED 에서의 칩 온도를 추정하는 방법입니다.
The chip area is S = 250x600 um, the heat transfer coefficient at the substrate bottom interface is 1e5 W/m^2/K, and the total dissipated power is 3.8 V * 0.02 A = 0.065 W.
So, if we neglect the heat resistance of the substrate and the
heterostructure, we can estimate the active region temperature as dT = P/(S*a) = 5.5 K.
